Scrona Wins Startup Innovation Challenge at IEEE ECTC 2025

This prestigious competition spotlights disruptive technologies shaping the future of microelectronics, advanced packaging, and semiconductor manufacturing. 

Scrona stood out among a field of highly competitive startups, winning top honors for its software defined MEMS-based multi-nozzle printing platform which is poised to transform microfabrication. The system delivers ultra-high resolution, digitally precise, and scalable additive manufacturing capabilities—ideal for applications in advanced packaging, heterogeneous integration, and quantum dot displays. 

A Breakthrough in Sustainable Microfabrication 

At the heart of Scrona’s innovation is its proprietary multi-nozzle printhead, which combines MEMS engineering with electrohydrodynamic ink ejection to achieve sub-micron precision – more than an order of magnitude beyond traditional inkjet systems. Importantly, its fully software-defined architecture allows it to be configured a wide range of materials, including highly viscous and functional inks, enabling complex interconnects, redistribution layers, and emerging UWB antenna structures to be printed with unprecedented precision and efficiency on flat and on most 3D surfaces.

The technology opens new possibilities for shrinking feature sizes while reducing material waste, cost, and manufacturing footprint. It directly addresses the growing demand for precision patterning in chiplet integration, fan-out wafer-level packaging, and high-performance heterogeneous systems.

Recognition from Industry Leaders

The Startup Innovation Challenge was sponsored by Kiterocket and Yole Group, bringing together a jury of industry veterans, technologists, and venture leaders from Applied Ventures, Lam CVC, Micron Ventures and Silicon Catalyst. Scrona’s presentation and live Q&A during the event highlighted the versatility and scalability of its platform for high-throughput production, earning strong support from the judges.

The final round culminated in a tie-breaker decision between Scrona and fellow finalist ICSPI. Scrona’s clear vision, technology maturity, and relevance to immediate market needs secured its position as the winner of the 2025 challenge.

“Winning at ECTC is more than a recognition – it’s a milestone,” said Dr. Patrick Heissler, CEO of Scrona. “This validates our approach and energizes our team and partners as we move toward scaling up production and enabling next-gen electronics.”

This latest recognition at ECTC 2025 follows a series of technical milestones and global partnerships Scrona has achieved over the past year. With rising interest from consumer electronics and semiconductor manufacturers, R&D labs, and toolmakers, the company has now started the transition from pilot systems to full-volume implementations.